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COBPAD 3X4 Wafer Layout

COBPAD 3X4 Wafer Layout

top & bottom copper layers for COBPAD 3×4, incl. invalid zone markers.

FREE

File Details

File Type
DWG
Type
Detail
Language
Chinese
Materials
N/A
Units
Metric
Area
1 – 9 m² (10.8 – 96.9 ft²)
Uploaded by
Plan DWG
Category
Blocks & Models, Electronic Components & Devices
Published
Jun 17, 2026

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Tags

3×4 chip on board cob cob pad layout copper layer integrated circuit microelectronics pad semiconductor wafer
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