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ChipMOS ANV153XT9115A STBGA 153L Semiconductor Bonding Diagram Layout

Semiconductor wire bond layout diagram for ANV153XT9115A STBGA 153L package with dimensions and netlist.

Bonding diagram for ANV153XT9115A showing wire bond layout for Samsung 14nm 64GB & PS8225 components. Incl. die dimensions, 0.7mil Au wire specs, pinout netlist, and more. 從 VSS/GND 開始銲線.

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File Details

File Type
DWG
Type
Plan
Language
English
Materials
Other
Units
Metric
Uploaded by
Studio DWG
Category
Blocks & Models, Electronic Components & Devices
Published
Jun 10, 2026
Price $5.00
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Tags

ANV153XT9115A BGA package bonding diagram CAD layout chipmos electronic components electronics design IC packaging integrated circuit layout drawing microchip Samsung 64GB semiconductor STBGA 153L wire bond
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