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Phison ANV 153L Stacked BGA Bonding and Substrate Layout

Technical CAD drawing of a 153-lead stacked BGA substrate layout and wire bonding diagram.

Bonding diagram for a 153-lead stacked BGA package (11.5x13x1.2mm) featuring PS8229 and BiCS3 components. Shows substrate geometry, pinouts, and specific wire bond details using 0.7mil Au wire.

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File Details

File Type
DWG
Type
Detail
Language
English
Materials
Plastic, Other
Units
Metric
Area
1 – 9 m² (10.8 – 96.9 ft²)
Uploaded by
Blueprint Hub
Category
Blocks & Models, Electronic Components & Devices
Published
Jun 3, 2026
Price $5.00
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Tags

153L BGA BiCS3 electronic component engineering detail flash memory IC layout Phison PS8229 semiconductor stacked BGA substrate wire bonding
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