Bond shell for 40-lead QFN package, 5×5 mm body with 0.40 pitch. Shows die attach pad (3.7×3.7) & exposed pad (3.5×3.5) layout. Incl. plating specs (NiPdAu), leadframe material (C194 FH), and wire bond ring details. Standard for semiconductor packaging etc.
QFN 40L 5×5 mm 0.40 Pitch Bond Shell Leadframe
