Leadframe bond shell for a QFN 28L package, 4×4 mm size with a 0.40 mm pitch. Includes the layout for the bond pads, the 2.60 x 2.60 mm exposed pad & the larger 2.90 mm die attach pad. Specs for the C194 FH leadframe material and NiPdAu plating are included in the detail block.
Quik-Pak QFN 28L 4×4 mm 0.40 Pitch Bond Shell Leadframe
